tq p3m900 9 high linearity l na gain block datasheet rev . h 07 - 2 9 - 14 - 1 of 10 - disclaimer: subject to change without notice ? 20 14 triquint www.triquint.com applications ? repeaters ? mobile infrastructure ? lte ? / wcdma / edge / cdma ? general purpose wireless 3 - pin sot - ? 89 package product features ? 50 ? C ? 4000 ? mhz ? 2 1.8 ? db gain a t 1.9 ? ghz ? +3 9.5 ? dbm output ip3 ? 1.3 db noise figure a t 1.9 ? ghz ? 50 ohm cascadable gain block ? unconditional ly s table ? high input power capability ? +5v single supply, 125 ma current ? sot - 89 package functional block diagram pin configuration pin no. label 1 rf i n 2 g nd 3 rf out backside paddle g nd general description t he tqp3m9009 is a cascadable, high linearity gain block amplifier in a low - cost surface - mount package. at 1.9 ? ghz, the amplifier is targeted to provide 21.8 ? db gain, +39.5 ? dbm oip3, and 1.3 ? db noise figure while only drawing 125 ? ma current. the device is housed in a leadfree/green/rohs - compliant industry - standard sot - 89 package using a nipdau plating to eliminate the possibility of tin whiskering. the tqp3m9009 has the benefit of having high gain across a broad range of frequencies while also providing very low noise. this allows the device to be used in both receiver and transmitter chains for high performance s ystems. the amplifier is internally matched using a high performance e - phemt process and only requires an external rf choke and blocking/bypass capacitors for operation from a single +5v supply. the internal active bias circuit also enables stable operatio n over bias and temperature variations. the tqp3m9009 covers the 0.05 ? C ? 4 ? ghz frequency band and is targeted for wireless infrastructure or other applications requiring high linearity and/or low noise figure. ordering information part no. description tqp3m900 9 high linearity lna gain block tqp3m900 9 - pcb_if 0.05 ? C ? 0.5 ? ghz evaluation board tqp3m900 9 - pcb_rf 0.5 ? C ? 4 ? ghz evaluation board standard t / ? r size = 10 00 pieces on a 7 reel rf in gnd rf out gnd 1 2 3 4
tq p3m900 9 high linearity l na gain block datasheet rev . h 07 - 2 9 - 14 - 2 of 10 - disclaimer: subject to change without notice ? 20 14 triquint www.triquint.com recommended operating conditions parameter min typ max units device voltage (v dd ) +3.0 + 5.0 + 5.25 v t case - 40 +85 c tj for >10 6 hours mttf +1 9 0 c electrical specifications are measured at specified test co nditions. specifications are not guaranteed over all recommended operating conditions. absolute maximum ratings parameter rating storage temperature ? 6 5 to + 150 ? c rf input power, cw, 50 ? , t=25 ? c + 23 ? dbm device voltage (v dd ) + 7 v reverse devi ce voltage ?0.3 v operation of this device outside the parameter ranges given above may cause permanent damage. electrical specifications test conditions unless otherwise noted: v dd =+5 ? v, temp = +25 ? c, 50 ? system parameter conditions min typ max units operational frequency range 50 4000 mhz test frequency 1900 mhz gain 20 21.8 2 3 db input return loss 1 3 db output return loss 1 4 db output p1db +2 2 dbm output ip3 pout= + 3 ? dbm ? / ? tone, ?f= 1 ? mhz +3 6 .5 +3 9.5 dbm noise figure 1.3 db current, i dd 12 5 1 5 0 ma thermal resistance, jc junction to case 34 c/w
tq p3m900 9 high linearity l na gain block datasheet rev . h 07 - 2 9 - 14 - 3 of 10 - disclaimer: subject to change without notice ? 20 14 triquint www.triquint.com s - parameters test conditions: v dd = +5 ? v, i dd = 125 ?ma , t=+25 ? c, 50 ? system, calibrated to device leads freq ( m hz) s11 (db) s11 (ang) s21 (db) s21 (ang) s12 (db) s1 2 (ang) s22 (db) s22 (ang) 50 ? 16.66 ? 149.04 27.36 171.55 ? 29.65 1.22 ? 13.56 179.33 100 ? 14.86 ? 157.51 27.12 166.00 ? 29.37 ? 1.50 ? 13.09 174.97 200 ? 13.56 ? 165.34 26.70 156.36 ? 29.26 ? 5.67 ? 12.78 159.12 400 ? 12.51 ? 173.30 26.14 137.87 ? 29.42 ? 14.20 ? 13. 06 133.47 600 ? 11.37 178.88 25.53 119.50 ? 29.63 ? 21.58 ? 13.69 110.30 800 ? 10.40 169.81 24.85 102.41 ? 30.03 ? 28.26 ? 14.46 86.04 1000 ? 9.76 160.89 24.16 86.01 ? 30.28 ? 35.35 ? 15.64 62.04 1200 ? 9.31 150.48 23.40 70.36 ? 30.96 ? 40.26 ? 16.58 37.31 1400 ? 8.84 139.39 22.82 55.48 ? 31.05 ? 46.78 ? 17.14 11.49 1600 ? 8.51 128.52 22.31 41.20 ? 31.76 ? 51.29 ? 17.34 ? 12.33 1800 ? 8.33 116.42 21.66 27.52 ? 2.00 ? 58.53 ? 17.04 ? 33.75 2000 ? 8.16 104.69 21.23 13.67 ? 32.50 ? 63.59 ? 16.80 ? 57.05 2200 ? 8.01 92.36 20.82 0.68 ? 33. 07 ? 66.83 ? 16.28 ? 76.12 2400 ? 8.06 79.88 20.33 ? 13.12 ? 33.72 ? 72.40 ? 15.48 ? 95.17 2600 ? 8.13 66.42 20.02 ? 26.88 ? 34.02 ? 77.18 ? 14.43 ? 113.34 2800 ? 8.14 51.54 19.74 ? 41.54 ? 34.42 ? 81.16 ? 13.66 ? 128.34 3000 ? 8.00 35.02 19.52 ? 55.82 ? 35.18 ? 86.54 ? 12.61 ? 142.44 3200 ? 8.13 17.50 19.28 ? 71.00 ? 36.25 ? 88.92 ? 11.99 ? 157.55 3400 ? 7.86 ? 3.63 19.10 ? 87.06 ? 36.83 ? 94.66 ? 11.31 ? 167.91 3600 ? 7.65 ? 26.69 18.91 ? 103.86 ? 37.20 ? 96.43 ? 10.62 ? 179.13 3800 ? 7.20 ? 52.39 18.59 ? 121.75 ? 38.27 ? 102.65 ? 10.05 170.24 4000 ? 6.39 ? 79.22 18.17 ? 140.35 ? 39.25 ? 102.05 ? 9.83 159.78
tq p3m900 9 high linearity l na gain block datasheet rev . h 07 - 2 9 - 14 - 4 of 10 - disclaimer: subject to change without notice ? 20 14 triquint www.triquint.com tqp3m900 9 - pcb_if ? / ? rf evaluation board q1 c2 l1 j3 j4 c1 r1 c3 q1 j2 rf output j4 gnd j3 v dd 1 2, backside paddle 3 j1 rf input l1 r1 0 ? c2 c1 c3 notes: 1. see pc board layout, page 8 for more information. 2. components shown on the silkscreen but not on the schematic are not used. 3. r 1 (0 mxpshupd y be replaced with copper trace in the target application layout. 4. the recommended component values are dependent upon the frequency of operation. 5. all components are of 0603 size unless stated on the schematic. bill of material ? C ? tqp3m900 9 - pcb_if ? / ? rf reference designation tqp3m9009 - pcb_if tqp3m9009 - pcb_rf 50 ? C ? 500 mhz 500 ? C ? 4000 mhz q1 tqp3m900 9 tqp3m900 9 c 1 , c 2 1000 pf 100 pf c 3 0.01 uf 0.01 uf l 1 330 nh 68 nh d1 do not place r 1 0 performance can be optimized at frequency of interest by u sing recommended component values shown in the table below. reference designation frequency (mhz) 500 2000 2500 3500 c 1 , c 2 100 pf 22 pf 22 pf 22 pf l 1 82 nh 22 nh 18 nh 15 nh
tq p3m900 9 high linearity l na gain block datasheet rev . h 07 - 2 9 - 14 - 5 of 10 - disclaimer: subject to change without notice ? 20 14 triquint www.triquint.com typical performance ?? C ? tqp3m900 9 - pcb_rf test conditions unless o therwise noted: v dd =+5 ? v, i dd = 125 ? ma, temp = +25 ?c , 50 ? system. parameter typical value units frequency 500 900 1900 2700 3500 4000 mhz gain 25.7 24.7 21.8 20 18.9 18 db input return loss 12 12 13 13 8 6 db output return loss 11 13 14 10 10 11.5 db output p1db +22.5 +21.8 +22 +21.6 +21.8 +20.7 dbm oip3 ? (1) +41.4 +40.5 +39.5 +39 +37.9 +35.8 dbm noise figure ? (2) 0.9 0.9 1.3 1.7 2.1 2.4 db notes: 1. oip3 measured with two tones at an output power of +3 ? dbm ? / ? tone separated by 1? mhz. 2. noise figure value s in the table above includes board losses . approx. = 0.1db at 2 ? ghz. performance plots ? tqp3m900 9 - pcb_rf test conditions unless otherwise noted: v dd =+5 ? v, i dd = 125?ma, temp = +25 ?c, 50? system. 10 15 20 25 30 500 1000 1500 2000 2500 3000 3500 4000 gain (db) frequency (mhz) gain vs. frequency +85 c +25 c ?20 c ?40 c -20 -15 -10 -5 0 500 1000 1500 2000 2500 3000 3500 4000 |s11| (db) frequency (mhz) input return loss vs. frequency +85 c +25 c ?20 c ?40 c -20 -15 -10 -5 0 500 1000 1500 2000 2500 3000 3500 4000 |s22| (db) frequency (mhz) output return loss vs. frequency +85 c +25 c ?20 c ?40 c 0 1 2 3 4 500 1000 1500 2000 2500 3000 3500 4000 nf (db) frequency (mhz) noise figure vs. frequency +85 c +25 c ?40 c 30 35 40 45 50 0 2 4 6 8 10 12 oip3 (dbm) pout / tone (dbm) output ip3 vs. pout / tone freq = 1900 mhz 1 mhz tone spacing +85 c +25 c ?40 c 30 35 40 45 50 500 1000 1500 2000 2500 3000 3500 4000 oip3 (dbm) frequency (mhz) output ip3 vs. frequency pout=+3 dbm/tone 1 mhz tone spacing, +85 c +25 c ?40 c 16 18 20 22 24 26 500 1000 1500 2000 2500 3000 3500 4000 p1db (db) frequency (mhz) p1db vs. frequency +85 c +25 c ?40 c 105 110 115 120 125 130 -40 -15 10 35 60 85 i dd (ma) temperature ( c) i dd vs. temperature cw signal 40 45 50 55 60 65 0 500 1000 1500 2000 2500 3000 3500 4000 oip2 (dbm) frequency (mhz) output ip2 vs. frequency pout = +3 dbm / tone 1 mhz tone spacing temp.=+25 c
tq p3m900 9 high linearity l na gain block datasheet rev . h 07 - 2 9 - 14 - 6 of 10 - disclaimer: subject to change without notice ? 20 14 triquint www.triquint.com performance plot s ? tqp3m9009 - pcb_rf (contd.) test conditions unless otherwise noted: v dd =+5 ? v, i dd = 125?ma, temp = +25 ? c, 50 ? system. 25 30 35 40 45 3 4 5 6 7 oip3 (dbm) v dd (volts) output ip3 vs. v dd pout/tone = +3 dbm tone spacing = 1 mhz temp.=+25 c 1900 mhz 900 mhz 10 15 20 25 30 3 4 5 6 7 p1db (dbm) v dd (volts) p1db vs. v dd temp.=+25 c 1900 mhz 900 mhz 0.0 0.5 1.0 1.5 2.0 2.5 3.0 3 4 5 6 7 nf (db) v dd (volts) noise figure vs. v dd 1900 mhz 900 mhz 1900 mhz 900 mhz temp.=+25 c 105 110 115 120 125 3 4 5 6 7 i dd (ma) v dd (volts) i dd vs v dd temp.=+25 c
tq p3m900 9 high linearity l na gain block datasheet rev . h 07 - 2 9 - 14 - 7 of 10 - disclaimer: subject to change without notice ? 20 14 triquint www.triquint.com performance plots ? tqp3m900 9 - pcb_i f test conditions unless otherwise noted: v dd =+5 ? v, i dd = 125?ma, temp = +25 ? c, 50 ? system. 22 24 26 28 30 0 100 200 300 400 500 gain (db) frequency (mhz) gain vs. frequency +85 c +25 c ?20 c ?40 c -20 -15 -10 -5 0 0 100 200 300 400 500 |s11| (db) frequency (mhz) input return loss vs. frequency +85 c +25 c ?20 c ?40 c -20 -15 -10 -5 0 0 100 200 300 400 500 |s22| (db) frequency (mhz) output return loss vs. frequency +85 c +25 c ?20 c ?40 c 0.0 0.5 1.0 1.5 2.0 2.5 0 100 200 300 400 500 nf (db) frequency (mhz) noise figure vs. frequency +85 c +25 c ?40 c 30 35 40 45 50 0 100 200 300 400 500 oip3 (dbm) pout / tone (dbm) output ip3 vs. pout/tone pout=3 dbm/tone 1 mhz tone spacing, +85 c +25 c ?40 c 18 20 22 24 26 0 100 200 300 400 500 p1db (db) frequency (mhz) p1db vs. frequency +85 c +25 c ?40 c typica l performance ? tqp3m900 9 - pcb_i f test conditions unless otherwise noted: v dd =+5 ? v, i dd = 125?ma, temp = +25 ? c, 50 ? system. parameter typical value units frequency 70 100 200 500 mhz gain 27 26.8 2 6.4 25.8 db input return loss 12 13 13 13 db output return loss 11 11 12 13 db output p1db +21.6 +21.9 +21.9 +22.2 dbm oip3? (1) +37.6 +38.8 +39 +41.4 dbm noise figure ? (2) 1.4 1.3 0.9 0.9 db notes: 1. oip3 measured with two tones at an output power of +3 ? dbm ? / ? tone separated by 1? mhz. 2. noise figure values in the table above includes board losses . approx.?= 0.1 ? db at 2 ? ghz.
tq p3m900 9 high linearity l na gain block datasheet rev . h 07 - 2 9 - 14 - 8 of 10 - disclaimer: subject to change without notice ? 20 14 triquint www.triquint.com pin configuration and description rf in gnd rf out / v dd 1 2 3 backside paddle - gnd pin no. label description 1 rf in rf i nput ; matched to 50 ohms. external dc block is requi red. 2, backside paddle gnd rf/dc g round . use recommended via pattern to minimize inductance and thermal resistance. see pcb mounting pattern for suggested footprint. 3 rf out? /? v dd rf output, matched to 50 ohms. external dc block and bias voltage requir ed. evaluation board pcb information triquint pcb 1075825 material and stack - up 5 0 ohm line dimensions : width = .0 28, spacing = .028
tq p3m900 9 high linearity l na gain block datasheet rev . h 07 - 2 9 - 14 - 9 of 10 - disclaimer: subject to change without notice ? 20 14 triquint www.triquint.com package marking and dimensions package marking : part identifier ? 3m900 9 assembly c ode ? yxxx n ote s : 1. all dimensions are in millimeters. angles are in degrees. 2. dimension and tolerance formats conform to asme y14.4m - 1994. 3. the terminal #1 identifier and terminal numbering conform to jesd 95 - 1 spp- 012. 4. contact plating: nipdau pcb mounting pattern notes: 1. all dimensions are in millimeters. angles are in degrees. 2. ground / thermal vias are critical for the proper performance of this device. vias should use a .35mm (#80 / .0135) diamete r drill and have a final plated thru diameter of .25 mm (.010 ). 3. add as much copper as possible to inner and outer layers near the part to ensure optimal thermal performance. 4. rf trace width depends upon the pc board material and construction. 5. use 1 oz. copper minimum. 0.10 (0.004) 3 places m t s z y s 1 2 3 -z- 4 1.62 (.064) 4.40 (.173) .35 (.014) .36 (.014) .44 (.017) 1.40 (.055) d1 d c b1 b symbol a 4.60 (.181) 4.50 (.177) 1.83 (.072) 1.73 (.068) 1.60 (.063) max .44 (.017) .48 (.019) .56 (.022) .50 (.020) .40 (.016) .42 (.0165) 1.50 (.059) typ min 2.2 (.087) 3.94 (.155) 2.13 (.084) 2.29 (.090) m e h l e1 e1 e symbol 2.6 (.102) 2.40 (.095) 2.29 (.090) 2.60 (.102) 4.25 (.167) 1.20 (.047) 1.50 bsc (.059) 1.10 (.043) 4.10 (.161) 3.00 bsc (.118) 2.20 (.087) 2.50 (.098) max min .89 (.035) typ 7 a b e e1 2x b1 e l h d1 d -y- c -t- e1 m d1 d1 alternate backside patterns - reflow compatible (part may be supplied with either pattern) 3m900 9 yxxx
tq p3m900 9 high linearity l na gain block datasheet rev . h 07 - 2 9 - 14 - 10 of 10 - disclaimer: subject to change without notice ? 20 14 triquint www.triquint.com product compliance information esd sensiti vity ratings caution! esd - sensitive device esd rating: class 1 a value: 250v to < 500 v test: human body model (hbm) standard: esda?/? jedec standard js - 001- 2012 esd rating: class c3 value: passes 1000 v test: charg ed device model (cdm) standard: jedec standard jesd22 - c101 f solderability compatible with both lead - free (260c maximum reflow temperature) and tin/lead (245c maximum reflow temperature) soldering processes. contact plating: nipdau rohs compliance this part is compliant with eu 2002/95/ec rohs directive (restrictions on the use of certain hazardous substances in electrical and electronic equipment). this product also has the following attributes: ? lead free ? halogen free (chlorine, bromine) ? antimo ny free ? tbbp - a (c 15 h 12 br 4 0 2 ) free ? pfos free ? svhc free msl rating msl rating: level 3 test: 260c convection reflow standard: jedec standard ipc/jedec j - std - 020 contact information for the latest specifications, additional product information, worldwide sales and distribution locations, and information about triquint: web: www.triquint.com tel: +1.503.615.9000 email: info - sales@t riquint .com fax: +1.503.6 15.8902 for technical questions and application information: email: sjcapplications.engineering@ triquint .com important notice the information contained herein is believed to be reliab le. triquint makes no warranties regarding the information contained herein. triquint assumes no responsibility or liability whatsoever for any of the information contained herein. triquint assumes no responsibility or liability whatsoever for the use o f the information contained herein. the information contained herein is provided "as is, where is" and with all faults, and the entire risk associated with such information is entirely with the user. all information contained herein is subject to change without notice. customers should obtain and verify the latest relevant information before placing orders for triquint products. the information contained herein or any use of such information does not grant, explicitly or implicitly, to any party any pat ent rights, licenses, or any other intellectual property rights, whether with regard to such information itself or anything described by such information. triquint products are not warranted or authorized for use as critical components in medical, life - s aving, or life - sustaining applications, or other applications where a failure would reasonably be expected to cause severe personal injury or death.
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